Hot Interconnects

06/04/2026

🚀 Registration is now open for IEEE Hot Interconnects 2026!

📅 August 19–21, 2026
🌐 Virtual via Zoom Events
🎟️ Free attendance

You can find the registration instructions here:
https://hoti.org/2026/attendee_instructions.html

After registering, attendees will receive their personalized Zoom Events ticket and joining information by email.

Questions about registration? Contact us at [email protected]

We look forward to seeing you at HotI 2026!

05/27/2026

🚀 We are excited to introduce the Technical Program Committee for IEEE Hot Interconnects 2026.

This year’s TPC brings together leading experts from academia, national laboratories, and industry, spanning high-performance interconnects, datacenter networking, AI infrastructure, memory systems, accelerators, optical and electrical fabrics, and large-scale distributed systems.

Their expertise will be essential in shaping a strong technical program and selecting the papers that capture the latest advances and emerging directions in the field.

A big thank you to all TPC members for their time, service, and contribution to the HotI community! 🙌

🔹 2026 Technical Program Committee
Khaled Diab, Hewlett Packard Enterprise
Kapil Shrikhande, Upscale AI
Weiyang Wang, Massachusetts Institute of Technology
Yuyang Wang, University of Connecticut
Scott Hemmert, Sandia National Laboratories
Charles Clayton, NVIDIA
Xi Wang, University of California, Merced
Jongryool Kim, SK hynix Inc.
Yiwei Yang, University of California, Santa Cruz
Aurelien Bouteiller, AMD
Luke Chang, AMD
Peter Del Vecchio, Self
Shinji Sumimoto, The University of Tokyo
Ferrol Aderholdt, NVIDIA
Yuichiro Ajima, Fujitsu Limited
Ron Brightwell, Sandia National Laboratories
Swadesh Choudhary, Intel
Hans Eberle, NVIDIA
Pedro Javier Garcia, Universidad de Castilla-La Mancha
Hyun-Wook Jin, Konkuk University
Jithin Jose, Microsoft
Shelby Lockhart, AMD
Xiaoyi Lu, University of Florida
Mohiuddin Mazumder, Intel Corporation
Md Atiqul Mollah, Cornelis Networks
Kishore Punniyamurthy, NVIDIA
Kaushik Kandadi Suresh, NVIDIA
Raghunath Raja Chandrasekar, Amazon Web Services
Adrien Roussel, CEA
Craig Stunkel, NVIDIA
Hugo Taboada, CEA
Madeleine Glick, Columbia University
KC Liu, AWS

Thank you to the full committee for helping make Hot Interconnects 2026 possible. 🔥

05/19/2026

⏰ Final Reminder: HotI 2026 Submission Deadline is Tomorrow!

There’s still time to submit your work to IEEE Hot Interconnects 2026 (HotI 2026). We welcome submissions on a wide range of topics including:
🔗 Interconnect architectures
🌐 AI/ML networking
💡 Optical and emerging fabrics
🧩 Chiplet interconnects
⚡ Congestion control
🖥️ Disaggregated systems
…and more.

🗓 Key dates:
• Paper abstract deadline: May 20, 2026
• Submission deadline: May 20, 2026
• Notification of acceptance: June 26, 2026
• Camera-ready: July 17, 2026

📢 Full CFP:
👉 https://hoti.org/2026/call-for-papers.html

We look forward to your submissions and to seeing you at HotI 2026! 🚀
IEEE IEEE Computer Society

05/12/2026

📢 The IEEE Hot Interconnects Call for Tutorials is out!

HotI 2026 will take place virtually from August 19–21, 2026, with tutorials held on the final day: August 21, 2026.

We invite proposals for half-day and full-day tutorials exploring the technologies, systems, and design choices shaping modern interconnects across long, short, and ultra-short distances.

Tutorials may cover topics such as AI/ML networking, data center interconnects, optical fabrics, chiplet and accelerator interconnects, congestion management, SDN and overlays, traffic characterization, fault tolerance, and high-bandwidth low-latency I/O.

Hands-on segments are strongly encouraged to make tutorials more engaging and practical.

🗓 Key dates:
•⁠ ⁠Proposal deadline: June 5, 2026
•⁠ ⁠Notification of acceptance: June 12, 2026
•⁠ ⁠Materials due: July 31, 2026

Submissions are handled through EasyChair https://easychair.org/conferences?conf=hoti2026.

We look forward to receiving your tutorial proposals and seeing you at HotI 2026! 🚀

👉 Full Call for Tutorials: https://hoti.org/2026/call-for-tutorials.html
📩 Questions: [email protected]

05/07/2026

📢 Deadline Extended!
Good news for prospective authors: the submission deadline for HotI 2026 has been extended.

🗓 Updated key dates
Paper abstract deadline: May 20, 2026
Submission deadline: May 20, 2026
Notification of acceptance: June 26, 2026
Camera-ready: July 17, 2026

In addition, the author guidelines have now been uploaded to the website.

Please check them before preparing your submission:
👉 https://lnkd.in/dN8p4txy

Full CFP:
👉 https://lnkd.in/d8kypY3T

We look forward to receiving your submissions! 🚀

📢 The IEEE Hot Interconnects Call for Papers is out!

HotI 2026 will take place virtually from August 19–21, 2026, and this year's theme is:
🔗 Scale-Up, Scale-Out, Scale-Across: Do they really differ?

We welcome original research on interconnect architectures, optical and emerging fabrics, AI/ML networking, chiplet interconnects, congestion control, disaggregated systems, and much more.

Two submission tracks are available:
📄 Regular papers — up to 10 pages
⚡ Hot topic papers — up to 4 pages (positional, industry, or breaking results)

🗓 Key dates:
• Paper abstract deadline: May 9, 2026
• Submission deadline: May 15, 2026
• Notification of acceptance: June 26, 2026
• Camera-ready: July 17, 2026

Submissions via EasyChair. Best papers will be invited to an IEEE Micro Special Issue.

We look forward to seeing your work at HotI 2026! 🚀

👉 Full CFP: https://hoti.org/2026/call-for-papers.html

04/30/2026

The Universal Chiplet Interconnect Express (UCIe) Consortium joins IEEE Hot Interconnects 2026 as a Gold Sponsor ✨

Through an open ecosystem of chiplets for on-package innovations, UCIe is redefining how high-performance systems are designed and scaled.

We sincerely thank the UCIe Consortium for supporting HotI 2026 and for helping shape the future of high-performance interconnects.

See you at HotI 2026! 🚀

04/18/2026

✨Netpreme joins IEEE Hot Interconnects 2026 as a Silver Sponsor!
We sincerely thank Netpreme for supporting HotI 2026 and for helping shape the future of high-performance interconnects.
See you at HotI 2026! 🚀

04/14/2026

HotI 2026 (August 19-21, 2026) is the premier international forum dedicated to state-of-the-art interconnection technologies. Connect your brand with industry leaders today, by securing a sponsorship. See our short video for details:

Enjoy the videos and music you love, upload original content, and share it all with friends, family, and the world on YouTube.

04/07/2026

The UALink Consortium joins IEEE Hot Interconnects 2026 as a Gold Sponsor, bringing their expertise in developing an open, high-performance scale-up fabric designed to meet the growing communication demands of AI accelerators ✨

We sincerely thank the UALink Consortium for supporting HotI 2026 and for helping shape the future of high-performance interconnects.

See you at HotI 2026! 🚀

03/31/2026

IEEE Hot Interconnects 2026 proudly welcomes Eliyan as a Platinum Sponsor. ✨

Chiplet interconnects are becoming the defining challenge of the AI hardware era, and Eliyan is meeting it head-on. With PHY technology purpose-built for the bandwidth, power, and integration demands of modern AI systems, Eliyan is enabling the chiplet-based system-in-package designs that will power the next wave of breakthroughs.
Their mission and ours are closely aligned: pushing the boundaries of how chips, chiplets, and systems connect.

We thank Eliyan for their support and look forward to seeing them at HotI 2026! 🚀