06/18/2026
📢 Trending in OJ-SSCS: Most Cited Articles of 2026 Thus Far!
The IEEE Open Journal of the Solid-State Circuits Society (OJ-SSCS) continues to drive immediate global impact. These three papers have emerged as the most-cited research papers so far this year, shaping the future of AI hardware, next-gen wireless networks, and power management.
Which one is on your reading list?
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1. High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions
Authors: Shenggao Li, Mu-Shan Lin, Wei-Chih Chen, Chien-Chun Tsai
The Core: As AI/ML exponentially demands more computing performance, 2.5D and 3D chiplet integration is vital. This widely cited article addresses the crucial co-optimization of bandwidth density, energy efficiency, electromigration, and signal/power integrity using simpler parallel data buses and forwarded clocks.
Read the open-access paper: https://bit.ly/4jpEwIP
2. Terahertz Integrated Circuits and Systems for High-Speed Wireless Communications: Challenges and Design Perspectives
Author: Payam Heydari
The Core: Looking past 5G toward sub-THz and THz systems (100 GHz to 10 THz) for multi-gigabit wireless? This foundational paper lays bare the exact limits of conventional transceivers and explores pathways to address challenges in front-end amplifiers, LO generation, and antenna arrays.
Read the open-access paper: https://bit.ly/4acCFmG
3. An Overview of Hybrid DC–DC Converters: From Seeds to Leaves
Authors: Yan Lu, Junwei Huang, Zhiguo Tong, Tingxu Hu, Wen-Liang Zeng, Mo Huang, Xiangyu Mao, Guigang Cai
The Core: Delivering sub-1 V rails from high-voltage buses to modern processors poses severe power-delivery challenges. This brilliant review charts the evolution of switched-capacitor-inductor (SCI) hybrid buck topologies across 6 distinct seeds, providing circuit designers with intuitive rules of thumb.
Read the open-access paper: https://bit.ly/3JXktSB
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