IC Taiwan Grand Challenge

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IC Taiwan Grand Challenge

ICTGC is an initiative started by the NSTC for participants from around the world who aim to cooperate with Taiwan's semiconductor industry.

31/07/2026

🏆 ICTGC Batch 4 Winner |
As AI models continue to grow larger and more power-hungry, how can we build AI infrastructure that's both more powerful and more energy-efficient?

Germany-based Linque, one of the winners of ICTGC Batch 4 in the AI Core Technologies and Chips category, has developed Linque RISE, an all-optical switching technology that replaces conventional data center network switches with programmable silicon photonics, significantly reducing network power consumption, latency, and hardware footprint.

As AI training scales rapidly, improving network efficiency has become a critical challenge for next-generation AI infrastructure. Linque's all-optical switching technology dramatically reduces power consumption and latency while delivering up to 20× greater AI deployment efficiency, paving the way for faster, more sustainable AI data centers.

🔗 Learn more about Linque’s innovative technology: https://innovex.computex.biz/show/newsReleaseDetails.aspx?newsId=823

🤝 Interested in collaborating with Linque?
Contact the team directly, or reach out to ITRI for technology matchmaking in Taiwan.
📩 Linque: [email protected]
📩 ITRI (Industrial Technology Research Institute) : [email protected]

29/07/2026

🎥 Meet ICTGC Batch 4 Winner –
How can AI data centers reduce network power consumption while scaling AI computing?

Hear from the Linque team as they explain how programmable silicon photonics is shaping next-generation data centers, and why Taiwan is key to bringing their technology to market.

🤝 Interested in collaborating with Linque?
Contact the team directly, or reach out to ITRI for technology matchmaking in Taiwan.
📩 Linque: [email protected]
📩 ITRI (Industrial Technology Research Institute) : [email protected]

27/07/2026

🏆 ICTGC Batch 4 Winner |
As AI computing power continues to grow, can chip cooling keep up?

Infiniflux, a UK-based startup and ICTGC Batch 4 winner in the AI Core Technologies and Chips category, has developed ChipCool, a two-phase liquid cooling technology. By integrating its patented Silicon Cold Plate directly above the chip die, ChipCool dramatically improves cooling performance without requiring changes to existing semiconductor manufacturing processes.

As demand for AI servers, high-performance computing (HPC), and data centers continues to surge, ChipCool enables GPUs to operate 15-20°C cooler, increases compute density, and extends chip lifespan. By overcoming thermal constraints, Infiniflux is helping power the next generation of AI infrastructure with higher performance and greater energy efficiency.

🔗 Learn more about Infiniflux’s innovative technology: https://innovex.computex.biz/show/newsReleaseDetails.aspx?newsId=820

🤝 Interested in collaborating with Infiniflux?
Contact the team directly, or reach out to ITRI for technology matchmaking in Taiwan.
📩 Infiniflux Ltd.: [email protected]
📩 ITRI (Industrial Technology Research Institute) : [email protected]

24/07/2026

🎥 Meet ICTGC Batch 4 Winner –
Even the most powerful AI chips can run into thermal bottlenecks.

Hear from the Infiniflux team as they share how their innovative liquid cooling technology is breaking through thermal limitations in AI chips, and why they chose to collaborate with Taiwan through ICTGC.

🤝 Interested in collaborating with Infiniflux?
Contact the team directly, or reach out to ITRI for technology matchmaking in Taiwan.
📩 Infiniflux Ltd.: [email protected]
📩 ITRI (Industrial Technology Research Institute) : [email protected]

22/07/2026

🏆 ICTGC Batch 4 Winner |
As chip designs become increasingly complex, how can developers shorten validation cycles and accelerate time-to-market when post-silicon validation still relies heavily on manual work?

Israel-based Caesarea Labs, a winner of ICTGC Batch 4 in the Smart Manufacturing category, has developed the world's first end-to-end Circuit Edit (CE) automation platform. By transforming post-silicon validation from a manual workflow into a software-driven process, the platform significantly improves chip debugging and validation efficiency.

Caesarea Labs' technology helps reduce validation time and testing costs, enabling engineering teams to complete design iterations faster and bring next-generation semiconductor products to market more efficiently.

🔗 Learn more about Caesarea Labs' innovative technology: https://innovex.computex.biz/show/newsReleaseDetails.aspx?newsId=818

🤝 Interested in collaborating with Caesarea Labs?
Contact the team directly, or reach out to ITRI for technology matchmaking in Taiwan.
📩 Caesarea Labs: [email protected]
📩 ITRI (Industrial Technology Research Institute) : [email protected]

20/07/2026

🎥 Meet ICTGC Batch 4 Winner –
What should semiconductor startups know before expanding into Taiwan?

Hear from the Caesarea Labs team as they share their experience working with ICTGC, connecting with Taiwan's semiconductor ecosystem, and one key piece of advice for startups entering the Taiwan market.

🤝 Interested in collaborating with Caesarea Labs?
Contact the team directly, or reach out to ITRI for technology matchmaking in Taiwan.
📩 Caesarea Labs: [email protected]
📩 ITRI (Industrial Technology Research Institute) : [email protected]

17/07/2026

🏆 ICTGC Batch 4 Winner |
As AI models continue to grow larger and GPU computing demands keep rising, can today’s memory technology keep up with the next generation of AI?

TopoLogic, a Japan-based winner of ICTGC Batch 4 in the AI Core Technologies and Chips category, has developed TL-RAM, a next-generation cache memory technology that combines SRAM-class speed with DRAM-class capacity. By dramatically increasing cache memory density, TL-RAM helps overcome memory bottlenecks and unlocks higher-performance AI computing.

🔗 Learn more about TopoLogic's innovative technology: https://innovex.computex.biz/show/newsReleaseDetails.aspx?newsId=817

🤝 Interested in collaborating with TopoLogic?
Contact the team directly, or reach out to ITRI for technology matchmaking in Taiwan.
📩 TopoLogic Inc.: [email protected]
📩 ITRI (Industrial Technology Research Institute) : [email protected]

15/07/2026

🎥 Meet ICTGC Batch 4 Winner –
Why did a Japanese semiconductor startup choose Taiwan to accelerate technology development?

Hear from the TopoLogic team as they share how ICTGC helped them connect with Taiwan’s semiconductor ecosystem, accelerate prototype validation, expand industry networks, and bring next-generation memory technology closer to market.

🤝 Interested in collaborating with TopoLogic?
Contact the team directly, or reach out to ITRI for technology matchmaking in Taiwan.
📩 TopoLogic Inc.: [email protected]
📩 ITRI (Industrial Technology Research Institute) : [email protected]

13/07/2026

🏆 ICTGC Batch 4 Winner | TECHNOLOGY
How can AI computing deliver the speed, precision, and reliability required for real-time drone tracking and micrometer-level semiconductor equipment alignment?

Taiwan-based ROCKCORE TECHNOLOGY, a winner in the AI Core Technologies and Chips category of ICTGC Batch 4, has developed the Advanced AI-FPC heterogeneous computing platform, integrating AMD CPU, GPU, and FPGA technologies to deliver high-performance AI computing for advanced equipment.

As AI continues to transform semiconductor manufacturing, smart defense, and precision equipment, ROCKCORE’s heterogeneous computing technology enables real-time image tracking, micrometer-level visual alignment, and intelligent inspection. The platform provides a more efficient and highly accurate AI solution for the next generation of advanced equipment.

🔗 Learn more about ROCKCORE's innovative technology: https://innovex.computex.biz/show/newsReleaseDetails.aspx?newsId=816

🤝 Interested in collaborating with ROCKCORE TECHNOLOGY?
Contact the team directly, or reach out to ITRI for technology matchmaking in Taiwan.
📩 ROCKCORE TECHNOLOGY CO., LTD.: [email protected]
📩 ITRI (Industrial Technology Research Institute) : [email protected]

10/07/2026

🎥 Meet ICTGC Batch 4 Winner – ROCKCORE TECHNOLOGY
How can low-latency, low-power computing improve the performance of advanced equipment and defense systems?

Hear from the ROCKCORE team as they share how their FPGA + CPU heterogeneous computing architecture powers next-generation AI solutions, and why they chose to expand their opportunities in Taiwan through ICTGC.

🤝 Interested in collaborating with ROCKCORE TECHNOLOGY?
Contact the team directly, or reach out to ITRI for technology matchmaking in Taiwan.
📩 ROCKCORE TECHNOLOGY CO., LTD.: [email protected]
📩 ITRI (Industrial Technology Research Institute) : [email protected]

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https://ictaiwanchallenge.org/

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