17/02/2025
https://youtu.be/w1MjuyTSYrg?si=MhaYLZiWPIgRJFhK
Hello everyone, welcome to Shenzhen Tengyu Grinding Technology. Look, this is our industrial park. It covers an area of about 13,000 square meters. It specializes in the R&D, production and selling of various high - precision lapping machines such as single - side lapping machines, double - sided lapping machines, wafer grinders, CMP polishing machines, and fully - automatic edge - grinding machines. These equipment are used for precision processing of wafer materials such as silicon carbide, sapphire and silicon wafers, as well as components in fields such as machinery, electronics, ceramics, optics, crystals, aviation, automobiles and molds.
Hello everyone, welcome to Shenzhen Tengyu Grinding Technology. Look, this is our industrial park. It covers an area of about 13,000 square meters. It specia...
